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US Patent Issued to Applied Materials on April 22 for "Scheduling substrate routing and processing" (California Inventor)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,282,315, issued on April 22, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Scheduling substrate routing and processing" was inv... Read More


US Patent Issued on April 22 for "Mechanical velocity enhancement assembly" (Mississippi Inventor)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,281,865, issued on April 22. "Mechanical velocity enhancement assembly" was invented by Eddie L Brooks (Tylertown, Miss.). According to the abs... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 22 for "Augmented reality device" (South Korean Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,282,164, issued on April 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Augmented reality device" was invented by Je... Read More


US Patent Issued to CHLITINA INTELLIGENCE on April 22 for "Dedifferentiated cell extract of Bletilla and method for whitening, anti-oxidation and anti-wrinkling applying the same, and cosmetic comprising the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,280,138, issued on April 22, was assigned to CHLITINA INTELLIGENCE Ltd. (Tortola, British Virgin Islands). "Dedifferentiated cell extract of Ble... Read More


US Patent Issued to Sumitomo Chemical on April 22 for "Method for manufacturing structure" (Japanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,487, issued on April 22, was assigned to Sumitomo Chemical Co. Ltd. (Tokyo). "Method for manufacturing structure" was invented by Fumimasa H... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 22 for "Semiconductor die with warpage release layer structure in package and fabricating method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,553, issued on April 22, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor die with warpage ... Read More


US Patent Issued to PopSockets on April 22 for "Docking connector platform for mobile electronic devices" (Colorado Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,282,359, issued on April 22, was assigned to PopSockets LLC (Boulder, Colo.). "Docking connector platform for mobile electronic devices" was inv... Read More


US Patent Issued on April 22 for "Plank finish applicator and method of use" (Illinois Inventor)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,279,691, issued on April 22. "Plank finish applicator and method of use" was invented by Jarod Sinkiawic (Rock City, Ill.). According to the ab... Read More


US Patent Issued to NIKE on April 22 for "Shoe" (Oregon Inventor)

ALEXANDRIA, Va., June 6 -- United States Patent no. D1,071,517, issued on April 22, was assigned to NIKE Inc. (Beaverton, Ore.). "Shoe" was invented by Risa Beck (Portland, Ore.). The patent was fil... Read More


US Patent Issued on April 22 for "Cable crimp cover" (Chinese Inventor)

ALEXANDRIA, Va., June 6 -- United States Patent no. D1,071,874, issued on April 22. "Cable crimp cover" was invented by Chao Xiang (Ningbo, China). The patent was filed on Sept. 27, 2022, under Appl... Read More